Overview：UNIAMIDE, a next-generation transparent high heat-resistant film, is specifically designed for optoelectronic and electronic applications. It maintains excellent clarity and light transmission even after reflow soldering processes.

1. Excellent Thermal Stability

   • Withstands processing temperatures ranging from 180°C to 260°C, making it suitable for high-temperature operations such as reflow soldering and soldering processes.
   • Ideal for emerging applications requiring both high transparency and high-temperature resistance.

2. Biaxially Oriented Film + High Toughness of Polyamide

   • Provides excellent flexibility and vibration-damping performance.
   • Offers enhanced durability against repeated bending and vibration, reducing the risk of cracking or breakage.

3. High Transparency

   • Maintains a high light transmittance of approximately 89-91% at wavelengths above 320 nm.

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  LED Transparent Display

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  Perovskite Solar Cell Substrate

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  Transparent FPC Substrate / Coverlay Film

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  UV Tape Substrate

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  Lightweight and Thin Electronic Devices

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  Speaker Diaphragm

• Raw Material Supply

  UNITIKA

  STEP 01

• Manufacturing & Processing

  Lamination

  STEP 02

• Finished Product

  FCCL

  STEP 03